Process Capabilities · 03
Suggestions for CIM processing, such as dimensional ceiling, minimum hole diameter, depth-to-diameter limits.
Formable Geometric Capability| Parameter | Value |
|---|---|
| Maximum XY-plane dimension | ~50×70mm (reference upper limit) |
| Z-direction | case-by-case (self-balancing capacity under stress) |
| Minimum hole diameter | Ø ≥ 0.3mm (≥0.5mm recommended) |
| Blind-hole depth-to-diameter ratio | ≤ 1.5:1 |
| Through-hole depth-to-diameter ratio | ≤ 3:1 |
Measured Case · Dense Hole Array
121 holes within a 25mm × 3mm area, 0.3mm hole diameter, 0.6mm hole spacing, formed in a single CIM shot, 100% pass rate. Not achievable by dry-pressing; machining would be prohibitively expensive and risks cracking the substrate.