WHITEPAPERS
Technical papers, each answering a question an engineer would genuinely ask
Real project data, honest boundaries, and the design rules that came out of them.
WP-01 · Why Black and White Zirconia Can't Share a Mold
Why can't two SKUs with identical geometry, differing only in black vs. white, share one mold?
Open the full page 02 · /whitepaper/weld-line-solutions/WP-02 · Weld-Line Formation and Layered Solutions
Large holes or dense hole arrays split the melt flow into two independent streams that rejoin behind the hole, forming a weld line. This is harder to manage in ceramic CIM than in plastic injection molding — why is it harder, can it be eliminated, and if not, how do you minimize the impact?
Open the full page 03 · /whitepaper/tolerance-conditions/ · Corresponds to DFM 02 · Process Capability 02WP-03 · The Conditions Behind ±0.05mm
Under what conditions can ±0.05mm be stably achieved - and does real production data actually hold up?
Open the full page 04 · /whitepaper/corner-design/ · Corresponds to D07 · Corner CrackingWP-04 · Corner Design & Drop Reliability
Why does ceramic drop-test failure almost always start at a corner - and how do you design around it?
Open the full page 05 · /whitepaper/gate-optimization/ · Corresponds to D08 · Open-Frame WarpageWP-05 · A Three-Round Gate-Iteration Study in CIM Distortion Control
Why do open-frame structures always warp toward the gate side after CIM sintering - and how did three independent gate-plan iterations take yield from 0% to 100%?
Open the full page 06 · /whitepaper/rf-performance/ · Corresponds to Material Selection Framework · Scenario 6: Wireless Signal PenetrationWP-06 · Material Selection for Wireless-Connected Devices: Ceramic's RF Advantage
For wireless-connected device housings, why does ceramic have a real, measurable RF-performance advantage over metal?
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