Case Studies · B
Dense Micro-Hole Array
Difficulty: 121 holes within a 25mm×3mm area, 0.3mm hole diameter, 0.6mm spacing. Almost no material between holes, demanding extreme fill uniformity - any local density variation deforms hole geometry after sintering. Dry pressing can't achieve this; machining is prohibitively costly and risks cracking the substrate.
Solution: a swappable-pin array mold plate, single-shot molding; precise gate/vent design paired with Moldflow optimization to keep hole diameter and spacing consistent across the batch; formulation tuning ensures uniform fill around the dense holes with no weld defects.
Customer value: complex hole-array structures can be formed in one CIM shot, eliminating a secondary drilling step, lowering per-part cost, and avoiding the dimensional error machining would introduce.